Printed Wire Boards

De Nora DT® plating anodes have become the primary choice in copper-via-filling electrodeposition process for manufacturing both HDI printed circuit boards and semiconductor substrates.


Uniform copper deposition, reliable via filling ability, elimination of surface roughness and low additive consumption make the use of De Nora DT® anodes the specified solution for today’s demanding circuit board designs.

De Nora DT® anodes are custom designed to ensure optimum plating performance:

  • Stable anode area providing uniform plating distribution and better via filling power;
  • Extremely low additive consumption and long service lifetime;
  • Improved plating bath life and performance by reducing additive by-products
  • Elimination of tedious anode maintenance;
  • Increased equipment uptime/capacity at high current density operation; 

De Nora also provides:

  • Total package solution by providing insoluble anodes and copper replenishment options
    • Full scale engineering service for upgrading from soluble to insoluble process
    • Specific anode configuration for existing plating line
  • After sale technical support in troubleshooting

The one disadvantage to insoluble anodes is that, unlike soluble anodes, the metal ion being plated must be replenished in the plating bath.  De Nora also offers a copper oxide dissolution system which is external to the plating tank.   The copper oxide dissolution system is designed to allow for a tightly controlled addition of copper ions into the plating bath thus controlling the copper concentration to within 5% of the specified bath concentration.