Uniform copper deposition, reliable via filling ability, elimination of surface roughness and low additive consumption make the use of De Nora DT® anodes the specified solution for today’s demanding circuit board designs.
De Nora DT® anodes are custom designed to ensure optimum plating performance:
De Nora also provides:
The one disadvantage to insoluble anodes is that, unlike soluble anodes, the metal ion being plated must be replenished in the plating bath. De Nora also offers a copper oxide dissolution system which is external to the plating tank. The copper oxide dissolution system is designed to allow for a tightly controlled addition of copper ions into the plating bath thus controlling the copper concentration to within 5% of the specified bath concentration.