Printed Wire Boards

De Nora DT® plating anodes have become the primary choice in copper-via-filling electrodeposition process for manufacturing both HDI printed circuit boards and semiconductor substrates.

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Uniform copper deposition, reliable via filling ability, elimination of surface roughness and low additive consumption make the use of De Nora DT® anodes the specified solution for today’s demanding circuit board designs.

De Nora DT® anodes are custom designed to ensure optimum plating performance:

  • Stable anode area providing uniform plating distribution and better via filling power;
  • Extremely low additive consumption and long service lifetime;
  • Improved plating bath life and performance by reducing additive by-products
  • Elimination of tedious anode maintenance;
  • Increased equipment uptime/capacity at high current density operation; 

De Nora also provides:

  • Total package solution by providing insoluble anodes and copper replenishment options
    • Full scale engineering service for upgrading from soluble to insoluble process
    • Specific anode configuration for existing plating line
  • After sale technical support in troubleshooting
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The one disadvantage to insoluble anodes is that, unlike soluble anodes, the metal ion being plated must be replenished in the plating bath.  De Nora also offers a copper oxide dissolution system which is external to the plating tank.   The copper oxide dissolution system is designed to allow for a tightly controlled addition of copper ions into the plating bath thus controlling the copper concentration to within 5% of the specified bath concentration.

De Nora Tech, LLC

7590 Discovery Lane
Concord Ohio 44077
SurfaceFinishing@denora.com